Cerdip type of solid-state image sensing device, structure and method for gripping cerdip type of solid-state image sensing device

ABSTRACT

Disclosed is a cerdip type of solid-state image sensing device having a simple construction, capable of directly gripping and performing a positioning adjustment of a high accuracy. The cerdip type of solid-state image sensing device comprises a base on which photoelectric transfer devices are arranged in line along a main scanning direction, a sealed glass disposed on said base for fixing a lead frame, a wind frame disposed on said sealed glass, a transparent cover glass disposed on said wind frame, and gripped surface means for gripping said cerdip type of solid-state image sensing device.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a cerdip type of solid-state imagesensing device, a structure and a method for gripping the cerdip type ofsolid-state image sensing device for using in the interior of an imagereading apparatus such as a copying machine, an image scanner, afacsimile or the like.

2. Description of the Prior Art

Generally, an image reading apparatus which is incorporated in animaging apparatus and reads an image as an optical image by use of asolid-state image sensing device such as a CCD and so on is configuredto read by focusing an object 53 on a solid-state image sensing device61 through a focused lens 52 as shown in FIG. 10.

The used solid-state image sensing device 61 has a plurality ofmicro-photoelectric transfer devices (hereinafter, referred to as pixelseach having normally a micro-size of several μm by several μm) in whicha pixel line 31 is arranged in one straight line.

In such an image reading apparatus, a linear image focused by thefocused lens 52 is positioned on the solid-state image sensing device 61and the focused lens 52 or one linear pixel line 31 of the solid-stateimage sensing device 61 must be micro-motioned about X, Y and Z axes, inrotational directions of β and γ about Y and Z axes, respectively,(three axes and two rotational directions in five axes of X, Y, Z, β andγ axes) for adjusting a position thereof to read optical characteristic(focusing, magnification and so on) with a predetermined accuracy, asshown in FIG. 11.

Note that reference numeral 8 denotes an optical axis.

Here, a reason that adjustment is not effected with respect to an a axisabout the X axis is as follows.

When the β and γ axes which are vertical with the pixel line is notadjusted, a distance between the focused lens 52 and solid-state imagesensing device 61 is different every the pixel to deteriorate theaccuracy of optical characteristic. On the contrary, since the X axis isparallel with the pixel line, the distance between the focused lens 52and solid-state image sensing device 61 is not different every thepixel, and thus the optical characteristic is not subjected to aninfluence.

On the other hand, in recent, there may be used a solid-state imagesensing device having three pixel lines 31 a, 31 b and 31 c linearlyarranged in every pixels R, G and B which have a peak of spectralsensitivity in Red, Green and Blue to read color images as shown in FIG.12.

Normally, a high precision is required to position adjustment of thesolid-state image sensing device in 5 axis directions. There is requireda technic to accomplish such requirement in which if the solid-stateimage sensing device is attached to a frame, after position of thesolid-state image sensing device is adjusted as described above, theposition of the solid-state image sensing device is not deviated fromthe frame.

A reason why such technic is required is because of requiringreadjustment even though the high precision for the adjustment isperformed when the position of the solid-state image sensing devicedeviates from the frame on attachment and requiring disposal of anattached part in a case of adopting an attaching method which is notseparatable, thereby bringing to a long positioning adjustment andresulting in a high cost attaching method.

The solid-state image sensing device 61 is, also, mounted on a base 12within the imaging apparatus. The base 12 drives the solid-state imagesensing device 61 and acts to transmit an electrical output signal ofthe solid-state image sensing device 61 according to an optical image toa control section (not shown) of the image reading apparatus after theelectrical output signal is electrically processed.

If an object to be read in the image reading apparatus is an image, aline type of solid-state image sensing device in which a plurality ofmicro photoelectric transfer devices are disposed in one line is almostused. In this case, the image is read as a linear image. In a colorimage reading apparatus for reading a color image, a color solid-stateimage sensing device having three lines 31 a, 31 b and 31 c in whichpixels having a peak of spectral sensitivity in Red (hereinafterreferred to as R), Green (hereinafter referred to as G) and Blue(hereinafter referred to as B) are arranged in three lines every R, Gand B is used (see FIG. 12).

Furthermore, the solid-state image sensing device is classified inseveral kind by an outside structure (package structure). In recent, thecerdip type of solid-state image sensing devise is increasingly usedeven in an image reading apparatus for a low production cost.

FIG. 13 is a sectional view showing a basic structure of a conventionalcerdip type of solid-state image sensing device (for color, herein).

The cerdip type of solid-state image sensing device has a constructionas follows.

A CCD chip 63 which is a chip of the solid-state image sensing device ismounted on a base 62 of ceramic. Pixel lines 31 a, 31 b and 31 c areformed on the CCD chip 63. A lead frame 65 is secured to the base 62 bymeans of sealed glass 64 and is electrically connected to the CCD chip63 by wire-bonding between the lead frame 65 and CCD chip 63 with a leadwire 68. A wind frame 66 is bonded with the sealed glass 64. Atransparent cover glass 67 is secured to the wind frame 66 to seal theCCD chip 63.

As described above, in the image reading apparatus, the linear imagefocused by the focused lens 52 is positioned on the solid-state imagesensing device 61 and the solid-state image sensing device 61 must bemicro-motioned along or about the five axes of X, Y, Z, β and γ as shownin FIG. 11 for adjusting a position thereof to read the opticalcharacteristic (focusing, magnification and so on) with a predeterminedaccuracy during a producing step of the image reading apparatus.

Then, normally, an accuracy of the positioning adjustment of thesolid-state image sensing device is μm or 0.001° order in all the fiveaxes.

Here, the optical axis 8 in FIGS. 11 and 13 corresponds to a directionof the Z axis in a coordinate.

Directions of the X and Y axes correspond to main and sub scanningdirections, respectively in the image reading apparatus.

Further, α is about the X axis, β is about the Y axis and γ is about theZ axis.

It is necessary to grip the solid-state image sensing device 61 with aproducing apparatus (not shown) on production to perform the positioningadjustment as described above.

It, then, is considered that the solid-state image sensing device is notdirectly gripped, the base on which the solid-state image sensing deviceis mounted is gripped as an object of gripping.

However, the base 12 has a problem in a point of stiffness since thebase comprises a thin plate and normally, does not make of a materialhaving a high stiffness.

Upon gripping of a base having a low stiffness, the gripping causes thebase to deform resiliently to occur change of position of thesolid-state image sensing device 61. There is no problem on this fact ifa product has a low adjusting accuracy, but, if the solid-state imagesensing device is used for an image reading apparatus to which a highaccuracy should be requested, this deformation of the base becomes alarge problem.

Under the aforementioned circumstances, it is desirable that thesolid-state image sensing device is directly gripped as an object ofgripping on production.

In prior art, the cerdip type of solid-state image sensing device whichis economically advantageous, as described above has no any partsuitable to grip. Namely, since a side 62 a of the base 62 and a side 66a of the wind frame 66 are closing as shown in FIG. 14, there is noplane of gripping by a chuck.

Note that in FIG. 14, only a positional relationship of the base 62 andwind frame 66 is magnifically shown and the sealed glass 64 and coverglass 64 and so on are omitted. A side 61 a may not be a gripped planeof a chuck for projection of the side of the sealed glass 64 as shown inFIG. 13.

As described above, there is no a cerdip type of solid-state imagesensing device in which ability of gripping is considered in the priorart.

In a such condition, a gripping portion of the device must be providedon the base 12.

This results in elimination of adjusting accuracy of the image readingapparatus or a high cost of the image reading apparatus by no using thecerdip type of solid-state image sensing device. As a result, it is notcompatible with an image reading quality and economics.

SUMMARY OF THE INVENTION

From the above circumstances, it is an object of the present inventionto provide a cerdip type of solid-state image sensing device and astructure and a method for gripping the solid-state image sensingdevice.

To accomplish the above object, a cerdip type of solid-state imagesensing device according to one aspect of the present invention ischaracterized by comprising a base on which photoelectric transferdevices are arranged in line along a main scanning direction, a sealedglass disposed on said base for fixing a lead frame, a wind framedisposed on said sealed glass, a transparent cover glass disposed onsaid wind frame, and gripped surface means for gripping said cerdip typeof solid-state image sensing device.

The gripped surface means is formed by grinding a portion of outerperipheral surfaces of said base, sealed glass, wind frame and coverglass after they are superposed.

A cerdip type of solid-state image sensing device according to the otheraspect of the present invention is characterized by comprising a base onwhich photoelectric transfer devices are arranged in line along a mainscanning direction, a sealed glass disposed on said base for fixing alead frame, a wind frame disposed on said sealed glass, a transparentcover glass disposed on said wind frame, and gripped surface meansprovided on said cerdip type of solid-state image sensing device to gripit.

The gripped surface means is composed of side surfaces of one or more ofsaid base, sealed glass, wind frame and cover glass.

The side surfaces which are gripped are parallel with a direction thatsaid base, sealed glass, wind frame and cover glass are superposed andsaid main scanning direction, and most project over the side surfaceswhich are not gripped in a vertical direction to a plane including saidsuperposed and main scanning directions.

One example, the gripped surface means may be composed of the sidesurfaces of said base, sealed glass and wind frame.

The gripped surface means may be composed of the side surfaces of saidbase and wind frame.

The gripped surface means may be comprised of the surfaces of said baseand sealed glass.

The gripped surface means may be composed of the side faces of saidsealed glass and wind frame.

gripped surface means is composed of the side surfaces of said base.

The gripped surface means may be composed of the side surfaces of saidsealed glass.

The gripped surface means may be composed of the side surfaces of saidwind frame.

According to the other aspect of the present invention, provided is astructure for gripping a cerdip type of solid-state image sensing devicecomprising a base on which photoelectric transfer devices are arrangedin line along a main scanning direction, a sealed glass disposed on saidbase for fixing a lead frame, a wind frame disposed on said sealedglass, a transparent cover glass disposed on said wind frame and grippedsurface means provided on one or more of said base, sealed glass, windframe and cover glass for gripping said cerdip type of solid-state imagesensing device.

According to the further other aspect of the present invention, providedis a method for gripping a cerdip type of solid-state image sensingdevice comprising preparing a base on which photoelectric transferdevices are arranged in line along a main scanning direction, disposinga sealed glass on said base for fixing a lead frame, disposing a windframe on said sealed glass, disposing a transparent cover glass on saidwind frame and providing gripped surface means on one or more of saidbase, sealed glass, wind frame and cover glass for gripping said cerdiptype of solid-state image sensing device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of a cerdip type of solid-state image sensingdevice in a first embodiment according to the present invention.

FIG. 2 is a view showing a state of gripping the cerdip type ofsolid-state image sensing device in FIG. 1 by a chuck of a producingapparatus in an image reading apparatus, (A) is a view as viewed fromthe same direction as the cerdip type of solid-state image sensingdevice in FIG. 1, (B) is a view showing a cover glass from a directionof a Z axis.

FIG. 3 is a view showing a modification of gripping the cerdip type ofsolid-state image sensing device in FIG. 1 by the chuck of the producingapparatus in the image reading apparatus and is a view showing the coverglass from the Z axis direction similarly to FIG. 2(B).

FIG. 4 is a view showing a cerdip type of solid-state image sensingdevice in a second embodiment according to the present invention and isa view as viewed from the same direction as the cerdip type ofsolid-state image sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 5 is a view showing a cerdip type of solid-state image sensingdevice in a third embodiment according to the present invention and is aview as viewed from the same direction as the cerdip type of solid-stateimage sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 6 is a view showing a cerdip type of solid-state image sensingdevice in a fourth embodiment according to the present invention and isa view as viewed from the same direction as the cerdip type ofsolid-state image sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 7 is a view showing a cerdip type of solid-state image sensingdevice in a fifth embodiment according to the present invention and is aview as viewed from the same direction as the cerdip type of solid-stateimage sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 8 is a view showing a cerdip type of solid-state image sensingdevice in a sixth embodiment according to the present invention and is aview as viewed from the same direction as the cerdip type of solid-stateimage sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 9 is a view showing a cerdip type of solid-state image sensingdevice in a seventh embodiment according to the present invention and isa view as viewed from the same direction as the cerdip type ofsolid-state image sensing device in FIG. 1, similarly to FIG. 2(A).

FIG. 10 is a view showing an optical poisoning relationship of an objectand a focus lens.

FIG. 11 is a view showing a coordinate of six axes in a solid-stateimage sensing device and the focus lens.

FIG. 12 is a font view showing a conventional solid-state image sensingdevice.

FIG. 13 is a sectional view showing a basic construction of theconventional cerdip type of solid-state image sensing device.

FIG. 14 is a perspective view showing side surfaces of the cerdip typeof solid-state image sensing device.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A first embodiment of a cerdip type of solid-state image sensing device1 according to the present invention is shown in FIG. 1.

The cerdip type of solid-state image sensing device 1 is constructed tosuperpose a base 2 of ceramic, a CCD chip 3 mounted on the base 2, asealed glass 4 provided on an outer periphery of the CCD chip 3 on thebase 2, a wind frame 6 of ceramic attached through the sealed glass 4 tothe base 2 and a cover glass 7 attached to the wind frame 6 to seal theCCD chip 3.

The cerdip type of solid-state image sensing device 1 is provided with agripped structure which comprises gripped surface means. The grippedsurface means is formed from side surface means which is, for example,composed of upper and lower side surfaces 2 a of the base 2, upper andlower side surfaces 4 a of the sealed glass 4 and/or upper and lowerside surfaces 6 a of the wind frame 6.

These side surfaces 2 a, 4 a and 6 a form the same plane.

The gripping surface means is parallel to a plane including a superposeddirection, namely, an optical direction and a main scanning direction(direction of the pixel lines, namely, vertical direction to a surfaceof the drawing) and has a surface more projected in a direction verticalto a plane including the superposed and main scanning directions.

The gripping surface means (comprising the side surfaces 2 a, 4 a and 6a) can be engaged with an engaged surface 10 a of a chuck 10 foradjustment.

For example, the side surfaces 2 a, 4 a and 6 a are simultaneouslyground by holding with a jig after the base 2 and wind frame 6 arebonded by the sealed glass 4 in order to form the side surfaces 2 a, 4 aand 6 a in a parallel condition with the plane including the optical andmain scanning directions.

FIG. 2 is a view showing a gripped condition of the cerdip type ofsolid-state image sensing device in FIG. 1 by means of the chuck in anapparatus for producing the image reading apparatus, (A) is a viewshowing the cerdip type of solid-state image sensing as viewed from thesame direction as FIG. 1 and (B) is a view showing the cover glass asviewed from the direction of the same Z axis as in FIG. 13 (see FIG. 1).

As shown in FIG. 2(A), upon production of the image reading apparatus,in order to adjust a position of one or more lenses and the cerdip typeof solid-state image sensing device 1, the chuck 10 in the producingapparatus grips the side surfaces 2 a, 4 a and 6 a from upward anddownward.

Here, the engaged surface 10 a of the chuck 10 which engages with thecerdip type of solid-state image sensing device is, also, formed into aplain which is parallel with the plane including the directions of theoptical axis and main scanning.

As shown in FIG. 2(B), the side surface means gripped by the chuck 10 isnot provided with the same lead frames 5 as the lead frames 65 asdescribed above in FIG. 13. The lead frames 5 are disposed on thelongitudinal opposed ends of the solid-state imaging sensing device. Asa result, the side surface means between the lead frames are selected asthe gripped surface means gripped by the chuck. For this reason, thelead frames and lead lines are omitted in FIGS. 1 to 9.

In FIG. 2(B), three chucks are used to grippe the cerdip type ofsolid-state image sensing device 1 in which the two chucks grip theupper side surfaces of the device 1 and one chuck grips the lower sidesurfaces of the device 1. One chuck may be disposed on each of the upperand lower side surfaces, without being limited to the three chucks.

As described above, according to the aforementioned cerdip type ofsolid-state image sensing device of the first embodiment, because it hasthe gripped structure in which the gripped surface means parallel withthe plane including the optical and main scanning directions isprovided, and this gripped surface means can be directly gripped by thechuck 10 having the engaged surface 10 a which similarly is parallelwith the plane including the optical and main scanning directions, it isable to provide an image reading apparatus having a very high accuracyof positioning adjustment by use of the cerdip type of solid-state imagesensing device 1 having a lower cost. It is, also, able to maintain aenough contacting area which can be gripped although the cerdip type ofsolid-state image sensing device 1 is formed to thin, since the grippedsurface means is composed of the side surfaces 2 a, 4 a and 6 a.

There is, also, an advantageous effect that adjustment of the directionof the α axis is not required, since the gripped surface means of thecerdip type of solid-state image sensing device 1 and engaged surface 10a of the chuck 10 are parallel with the plane including the optical andmain scanning directions.

FIG. 3 shows a modification of gripping the cerdip type of solid-stateimage sensing device as shown in FIG. 1 by a chuck 11 in a producingapparatus of an image reading apparatus. FIG. 3 is a view of the coverglass side viewed from the direction of the Z axis similarly to FIG.2(B).

As shown in FIG. 3, the chuck 11 has a form of air-suction. Theair-suction type of chuck 11 has an engaged surface 11 a formed tocorrespond to a plane for contacting with the gripped surface means ofthe cerdip type of solid-state image sensing device 1. Morespecifically, the engaged surface 11 a contacts tightly with the grippedsurface means and sucks to grip it.

The chuck 11 may be used in either the upper side surfaces or the lowerside surfaces of the cerdip type of solid-state image sensing device 1.

Alternatively, the two chucks 11 may be provided on both the upper andlower side surfaces of the cerdip type of solid-state image sensingdevice 1. Also, a plurality of chucks may be disposed on one of theupper and lower side surfaces. The chuck 11 may be replaced by a chuck10 used in embodiments which will be described hereinafter.

FIG. 4 shows a cerdip type of solid-stated image sensing device in asecond embodiment according to the present invention and is a viewshowing the same state as the cerdip type of solid-state image sensingdevice of FIG. 1, similarly to FIG. 2(A).

Side surface means of the cerdip type of solid-state image sensingdevice 1 in the second embodiment is composed of upper and lower sidesurfaces 2 a of the base 2 and upper and lower side surfaces 6 a of thewind frame 6. These side surfaces place in the same plane as grippedsurface means gripped by any chuck 10.

The side surfaces are parallel with the plane including optical and mainscanning directions as described above and most project to a directionvertical to the plane including the optical and main scanningdirections, namely from the other side surfaces of the device 1.

These side surfaces 2 a and 6 a contact with an engaged surface 10 a ofthe chuck 10 for adjustment of position.

In order to form the side surfaces 2 a and 6 a in a parallel state withthe plane including the optical and main scanning directions, forexample, after the base 2 and wind frame 6 are bonded by the sealedglass 4 to project from the side surfaces 4 a of the sealed glass 4 insideward, the side surfaces 2 a and 6 a are simultaneously ground withthe cerdip type of solid-state image held by a jig.

Since the side surfaces 2 a and 6 a project over the side surface 4 aafter grinding, the side surface 4 a may be any configuration, forexample, a flat, convex, concave surface or the like.

In the cerdip type of solid-state image sensing device 1 in the secondembodiment, since the side surface means is composed of the sidesurfaces 2 a and 6 a of the base 2 and wind frame 6 which are made ofceramic having a high stiffness, as compared with the first embodiment,even though a gripped area is less, the same gripped accuracy can beobtained. Also, the same material is ground and therefore a high groundperformance is obtained. Further, a used amount of the sealed glass 4 isminimized.

FIG. 5 shows a cerdip type of solid-state image sensing device in athird embodiment according to the present invention and is a view asviewed from the same direction as the cerdip type of solid-state imagesensing device in FIG. 1.

Side surface means of the cerdip type of solid-state image sensingdevice in the third embodiment is composed of the side surfaces 2 a and4 a of the base 2 and sealed glass 4.

The side surfaces 2 a and 4 a are the same plane and are parallel withthe plane including the optical and main scanning directions, andfurther most project in the vertical direction to the plane includingthe optical and main scanning directions, as described above. These sidesurfaces contact with the aforementioned engaged surface 10 a of thechuck 10 for adjustment.

In order to form the side surfaces 2 a and 4 a in a parallel state withthe plane including the optical and main scanning directions, forexample, after the base 2 and wind frame 6 are bonded by the sealedglass 4, the side surfaces 2 a and 6 a are simultaneously ground withthe cerdip type of solid-state image held by a jig.

Since the side surfaces 2 a and 4 a project over the side surfaces 6 aafter grinding, the side surfaces 6 a may be any configuration, forexample, a flat, convex, concave surface or the like.

FIG. 6 shows a cerdip type of solid-state image sensing device in afourth embodiment according to the present invention and is a view asviewed from the same direction as the cerdip type of solid-state imagesensing device in FIG. 1.

Side surface means of the cerdip type of solid-state image sensingdevice in the fourth embodiment is composed of the side surfaces 4 a and6 a of the sealed glass 4 and wind frame 6.

The side surfaces 4 a and 6 a are the same plane and are parallel withthe plane including the optical and main scanning directions, andfurther most project in the vertical direction to the plane includingthe optical and main scanning directions, as described above. These sidesurfaces contact with the aforementioned engaged surface 10 a of thechuck 10 for adjustment.

In order to form the side surfaces 4 a and 6 a in a parallel state withthe plane including the optical and main scanning directions, forexample, after the base 2 and wind frame 6 are bonded by the sealedglass 4, the side surfaces 4 a and 6 a are simultaneously ground withthe cerdip type of solid-state image held by a jig.

Since the side surfaces 4 a and 6 a project over the side surfaces 2 aafter grinding, the side surfaces 2 a may be any configuration, forexample, a flat, convex, concave surface or the like.

FIG. 7 shows a cerdip type of solid-state image sensing device in afifth embodiment according to the present invention and is a view asviewed from the same direction as the cerdip type of solid-state imagesensing device in FIG. 1.

Side surface means of the cerdip type of solid-state image sensingdevice in the fifth embodiment is composed of the side surfaces 2 a ofthe base 2.

The side surfaces 2 a are the same plane and are parallel with the planeincluding the optical and main scanning directions, and further mostproject in the vertical direction to the plane including the optical andmain scanning directions, as described above. The side surfaces 2 acontact with the aforementioned engaged surface 10 a of the chuck 10 foradjustment.

In order to form the side surfaces 2 a in a parallel state with theplane including the optical and main scanning directions, for example,after the base 2 and wind frame 6 are bonded by the sealed glass 4, theside surfaces 2 a are ground with the cerdip type of solid-state imageheld by a jig.

Since the side surfaces 2 a project over the side surface 4 a and 6 aafter grinding, the side surface 4 a and 6 a may be any configuration,for example, a flat, convex, concave surface or the like. Also, thethickness (length of the optical direction) of the side surfaces 2 a ofthe base 2 may be large depending on a necessary accuracy. For example,the thickness is preferably 2 to 3 mm.

FIG. 8 shows a cerdip type of solid-state image sensing device in asixth embodiment according to the present invention and is a view asviewed from the same direction as the cerdip type of solid-state imagesensing device in FIG. 1.

Side surface means of the cerdip type of solid-state image sensingdevice in the sixth embodiment is composed of the side surfaces 6 a ofthe wind frame 6.

The side surfaces 6 a are the same plane and are parallel with the planeincluding the optical and main scanning directions, and further mostproject in the vertical direction to the plane including the optical andmain scanning directions, as described above. The side surfaces 6 acontact with the aforementioned engaged surface 10 a of the chuck 10 foradjustment.

In order to form the side surfaces 6 a in a parallel state with theplane including the optical and main scanning directions, for example,after the base 2 and wind frame 6 are bonded by the sealed glass 4, theside surfaces 6 a are ground with the cerdip type of solid-state imageheld by a jig.

Since the side surfaces 6 a project over the side surfaces 2 a and 4 aafter grinding, the side surfaces 2 a and 4 a may be any configuration,for example, a flat, convex, concave surface or the like. Also, thethickness (length of the optical direction) of the side surfaces 6 a ofthe wind frame 6 may be large depending on a necessary accuracy. Forexample, the thickness is preferably 2 to 3 mm.

FIG. 9 shows a cerdip type of solid-state image sensing device in aseventh embodiment according to the present invention and is a view asviewed from the same direction as the cerdip type of solid-state imagesensing device in FIG. 1.

Side surface means of the cerdip type of solid-state image sensingdevice in the seventh embodiment is composed of the side surfaces 4 a ofthe sealed glass 4.

The side surfaces 4 a are the same plane and are parallel with the planeincluding the optical and main scanning directions, and further mostproject in the vertical direction to the plane including the optical andmain scanning directions, as described above. The side surfaces 4 acontact with the aforementioned engaged surface 10 a of the chuck 10 foradjustment.

In order to form the side surfaces 4 a in a parallel state with theplane including the optical and main scanning directions, for example,after the base 2 and wind frame 6 are bonded by the sealed glass 4, theside surfaces 4 a are ground with the cerdip type of solid-state imageheld by a jig.

Since the side surfaces 4 a project over the side surfaces 2 a and 4 aafter grinding, the side surfaces 2 a and 6 a may be any configuration,for example, a flat, convex, concave surface or the like. Also, thethickness (length of the optical direction) of the side surfaces 4 a ofthe sealed glass 4 may be large depending on a necessary accuracy. Forexample, the thickness is preferably 2 to 3 mm.

As described above, according to the present invention, it is able touse the cerdip type of solid-state image sensing device having a lowcost because the cerdip type of solid-state image sensing device has thegripped structure comprises a plurality of side surfaces which areparallel with the optical and main scanning directions and most projectin the vertical direction to the plane including the optical and mainscanning directions to be gripped effectively by the chuck, wherebyenabling the high-accuracy adjustment of position of the cerdip type ofsolid-state image sensing device in a step of producing the imagereading apparatus.

Although the some embodiments have been described, the present inventionis not limited to these embodiments and various changes andmodifications can be made without departing the gist of the presentinvention.

1. A cerdip type of solid-state image sensing device comprising: a baseon which photoelectric transfer devices are arranged in line along amain scanning direction; a sealed glass disposed on said base for fixinga lead frame; a wind frame disposed on said sealed glass; a transparentcover glass disposed on said wind frame; and gripped surface means forgripping said cerdip type of solid-state image sensing device.
 2. Acerdip type of solid-state image sensing device according to claim 1,wherein said gripped surface means is formed by grinding a portion ofouter peripheral surfaces of said base, sealed glass, wind frame andcover glass after they are superposed.
 3. A cerdip type of solid-stateimage sensing device comprising: a base on which photoelectric transferdevices are arranged in line along a main scanning direction; a sealedglass disposed on said base for fixing a lead frame; a wind framedisposed on said sealed glass; a transparent cover glass disposed onsaid wind frame; and gripped surface means provided on said cerdip typeof solid-state image sensing device to grip it, said gripped surfacemeans being composed of side surfaces of one or more of said base,sealed glass, wind frame and cover glass, said side surfaces which aregripped being parallel with a direction that said base, sealed glass,wind frame and cover glass are superposed and said main scanningdirection, and most projecting over the side surfaces which are notgripped in a vertical direction to a plane including said superposed andmain scanning directions.
 4. A cerdip type of solid-state image sensingdevice according to claim 3, wherein said gripped surface means iscomposed of the side surfaces of said base, sealed glass and wind frame.5. A cerdip type of solid-state image sensing device according to claim3, wherein said gripped surface means is composed of the side surfacesof said base and wind frame.
 6. A cerdip type of solid-state imagesensing device according to claim 3, wherein said gripped surface meansis comprised of the surfaces of said base and sealed glass.
 7. A cerdiptype of solid-state image sensing device according to claim 3, whereinsaid gripped surface means is composed of the side faces of said sealedglass and wind frame.
 8. A cerdip type of solid-state image sensingdevice according to claim 3, wherein said gripped surface means iscomposed of the side surfaces of said base.
 9. A cerdip type ofsolid-state image sensing device according to claim 3, wherein saidgripped surface means is composed of the side surfaces of said sealedglass.
 10. A cerdip type of solid-state image sensing device accordingto claim 3, wherein said gripped surface means is composed of the sidesurfaces of said wind frame.
 11. A structure for gripping a cerdip typeof solid-state image sensing device comprising: a base on whichphotoelectric transfer devices are arranged in line along a mainscanning direction; a sealed glass disposed on said base for fixing alead frame; a wind frame disposed on said sealed glass; a transparentcover glass disposed on said wind frame; and gripped surface meansprovided on one or more of said base, sealed glass, wind frame and coverglass for gripping said cerdip type of solid-state image sensing device.